Capterra Glossary
Kerfless Wafering
In semiconductor manufacturing, the term "kerfless watering" describes a technique that uses lasers to cut through silicon wafers with minimal damage or contamination. The process is less expensive and more efficient than traditional methods like sawing because it doesn't require any additional material removal steps after cutting. However, this method only works on certain materials, such as gallium arsenide (GaAs), which has higher purity levels than silicon wafers made from other elements like carbon dioxide.
What Small and Midsize Businesses Need to Know About Kerfless Wafering
As a small business, utilizing kerfless watering can save time and money because it produces less waste than traditional methods. In addition, the process is much more accurate, so companies are less likely to end up with faulty products that need to be scrapped. Kerfless wafering is still a relatively new technology, so there may be some limitations on using materials. Still, as the process matures, even more businesses will likely start using it.
Related Terms
- Enterprise Resource Planning (ERP)
- Procurement
- Total Cost of Ownership (TCO)
- Vendor
- Supply Chain Planning (SCP)
- Telematics
- Senpai
- Vendor Management
- Value-Added Reseller (VAR)
- Bill of Materials (BOM)
- Supply Chain
- Smart Factory
- Scanner
- SCADA (Supervisory Control and Data Acquisition)
- Radio-frequency Identification (RFID)