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IC packaging and organic substrate solutions designed for various industries such as aerospace, defense, automotive, medical, communications, semiconductor, and consumer electronics applications and offers features such as IC packaging design and manufacturing, panel-level solutions, system-in-package technology, multi-chip module technology, thermal management, and substrate fabrication.
Provider
PCB Technologies
Located In
United States
Deployment
Cloud, SaaS, Web-Based
Content Source: iNPACK
Green rating bars show the winning product based on the average rating and number of reviews.
